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PCBs Repairs with BGA and FC Packages
Buřival, Tomáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Graduation thesis is specialized on dilemma of the integrated circuits with ball grid array. Chapter two describes several types of packages and confrontation of their characteristics. Chapter three considers possibilities of corrections these boards bedded with packages, mounting and demounting of these packages, method of camera control and also inspection of the soldering process. Chapter four attend to practical measuring of thermal profiles and their optimalization.
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Application of InTouch system for control of portal crane
Diblíková, Michaela ; Jáneš, Pavel (referee) ; Pásek, Jan (advisor)
Bachelor thesis deals with creating software for control and visualization (SCADA) laboratory model gantry crane system using InTouch. Furthermore, the connection to the PLC model crane and a functional language program in STEP7. The aim is to create objects and windows for visualizacion and cotrol automatic functions crane. The work is shown and described a program created in STEP 7 language and program for the actual visualization and control model of the portal crane system in InTouch.
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Application of InTouch system for control of portal crane
Diblíková, Michaela ; Jáneš, Pavel (referee) ; Pásek, Jan (advisor)
Bachelor thesis deals with creating software for control and visualization (SCADA) laboratory model gantry crane system using InTouch. Furthermore, the connection to the PLC model crane and a functional language program in STEP7. The aim is to create objects and windows for visualizacion and cotrol automatic functions crane. The work is shown and described a program created in STEP 7 language and program for the actual visualization and control model of the portal crane system in InTouch.
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|
|
PCBs Repairs with BGA and FC Packages
Buřival, Tomáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Graduation thesis is specialized on dilemma of the integrated circuits with ball grid array. Chapter two describes several types of packages and confrontation of their characteristics. Chapter three considers possibilities of corrections these boards bedded with packages, mounting and demounting of these packages, method of camera control and also inspection of the soldering process. Chapter four attend to practical measuring of thermal profiles and their optimalization.
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